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1

An FBAR Circulator

Torunbalci, Mustafa Mert, Odelberg, Trevor J., Sridaran, Suresh, Ruby, Richard C., Bhave, Sunil A.

Journal:

IEEE Microwave and Wireless Components Letters

Année:

2018

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2018

2

[IEEE 2014 IEEE Sensors - Valencia, Spain (2014.11.2-2014.11.5)] IEEE SENSORS 2014 Proceedings - Gold-tin eutectic bonding for hermetic packaging of MEMS devices with vertical feedthroughs

Torunbalci, Mustafa Mert, Demir, Eyup Can, Donmez, Inci, Alper, Said Emre, Akin, Tayfun

Année:

2014

Langue:

english

Fichier:

PDF, 1.55 MB

english, 2014

3

Advanced MEMS Process for Wafer Level Hermetic Encapsulation of MEMS Devices Using SOI Cap Wafers With Vertical Feedthroughs

Torunbalci, Mustafa Mert, Alper, Said Emre, Akin, Tayfun

Journal:

Journal of Microelectromechanical Systems

Année:

2015

Langue:

english

Fichier:

PDF, 2.90 MB

english, 2015

4

Magneto Acoustic Spin Hall Oscillators

Torunbalci, Mustafa Mert, Gosavi, Tanay Arun, Camsari, Kerem Yunus, Bhave, Sunil Ashok

Journal:

Scientific Reports

Année:

2018

Langue:

english

Fichier:

PDF, 3.58 MB

english, 2018

5

[IEEE 2014 International Symposium on Inertial Sensors and Systems (ISISS) - Laguna Beach, CA, USA (2014.02.25-2014.02.26)] 2014 International Symposium on Inertial Sensors and Systems (ISISS) - Wafer level hermetic encapsulation of MEMS inertial sensors using SOI cap wafers with vertical feedthroughs

Mert Torunbalci, Mustafa, Alper, Said Emre, Akin, Tayfun

Année:

2014

Langue:

english

Fichier:

PDF, 1.07 MB

english, 2014

6

Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding

Torunbalci, Mustafa Mert, Alper, Said Emre, Akin, Tayfun

Journal:

Sensors and Actuators A: Physical

Année:

2015

Langue:

english

Fichier:

PDF, 3.52 MB

english, 2015

7

[IEEE 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) - Estoril, Portugal (2015.1.18-2015.1.22)] 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) - A novel fabrication and wafer level hermetic sealing method for SOI-MEMS devices using SOI cap wafers

Torunbalci, Mustafa Mert, Alper, Said Emre, Akin, Tayfun

Année:

2015

Langue:

english

Fichier:

PDF, 1.62 MB

english, 2015

8

[IEEE 2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) - Hapuna Beach, HI, USA (2015.3.23-2015.3.26)] 2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings - Die size reduction by optimizing the dimensions of the vertical feedthrough pitch and sealing area in the advanced MEMS (aMEMS) process

Torunbalci, Mustafa Mert, Alper, Said Emre, Akin, Tayfun

Année:

2015

Langue:

english

Fichier:

PDF, 1.33 MB

english, 2015

9

A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process

Torunbalci, Mustafa Mert, Alper, Said Emre, Akin, Tayfun

Journal:

Procedia Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 825 KB

english, 2014

10

A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process

Torunbalci, Mustafa Mert, Alper, Said Emre, Akin, Tayfun

Journal:

Journal of Micromechanics and Microengineering

Année:

2015

Langue:

english

Fichier:

PDF, 2.88 MB

english, 2015

11

[IEEE 2016 74th Annual Device Research Conference (DRC) - Newark, DE, USA (2016.6.19-2016.6.22)] 2016 74th Annual Device Research Conference (DRC) - MESH Nano-Oscillator: All electrical doubly tunable spintronic oscillator

Ganguly, Samiran, Torunbalci, Mustafa M., Bhave, Sunil A., Camsari, Kerem Y.

Année:

2016

Langue:

english

Fichier:

PDF, 846 KB

english, 2016

12

[IEEE 2016 IEEE SENSORS - Orlando, FL, USA (2016.10.30-2016.11.3)] 2016 IEEE SENSORS - A novel method for fabricating MEMS three-axis accelerometers using low temperature Au-Sn eutectic bonding

Tez, Serdar, Torunbalci, Mustafa Mert, Akin, Tayfun

Année:

2016

Langue:

english

Fichier:

PDF, 965 KB

english, 2016

13

[IEEE 2018 IEEE Micro Electro Mechanical Systems (MEMS) - Belfast, United Kingdom (2018.1.21-2018.1.25)] 2018 IEEE Micro Electro Mechanical Systems (MEMS) - Acceleration insensitive hemispherical shell resonators using pop-up rings

Torunbalci, Mustafa Mert, Dai, Sen, Bhat, Ajay, Bhave, Sunil A.

Année:

2018

Langue:

english

Fichier:

PDF, 2.13 MB

english, 2018

14

Modular Compact Modeling of MTJ Devices

Torunbalci, Mustafa Mert, Upadhyaya, Pramey, Bhave, Sunil A., Camsari, Kerem Y.

Journal:

IEEE Transactions on Electron Devices

Année:

2018

Fichier:

PDF, 1.76 MB

2018

15

Modular Compact Modeling of MTJ Devices

Torunbalci, Mustafa Mert, Upadhyaya, Pramey, Bhave, Sunil A., Camsari, Kerem Y.

Journal:

IEEE Transactions on Electron Devices

Année:

2018

Langue:

english

Fichier:

PDF, 1.76 MB

english, 2018

16

[IEEE 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Berlin, Germany (2019.6.23-2019.6.27)] 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Mechanically Modulated Microwave Circulator

Torunbalci, Mustafa Mert, Sridaran, Suresh, Ruby, Richard C., Bhave, Sunil A.

Année:

2019

Langue:

english

Fichier:

PDF, 6.31 MB

english, 2019

17

[IEEE 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) - Vancouver, BC, Canada (2020.1.18-2020.1.22)] 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) - Mechanical Tuning of Magnetic Anisotropy

Torunbalci, Mustafa Mert, Bhave, Sunil Ashok

Année:

2020

Fichier:

PDF, 1.79 MB

2020